KRAVSPESIFIKASJON Probestasjon med laser for bruk på integrerte kretser. REQUIREMENT SPECIFICATION. Oslo 18.08.2010 KRIPOS (National Criminal Investigation Service) Pb 8163 Dep 0034 OSLO NORWAY Phone: +47 23 20 80 00 Fax: +47 23 20 82 81 Kjell Harald Andersen Senior Engineer Computer Forensic Section Phone (Direct line): +47 23 20 82 71 Email: kjell.harald.andersen@politiet.no
Innholdsfortegnelse / Table of Content 1. INNLEDNING (NORSK)... 3 1.1. HENSIKTEN MED DETTE DOKUMENTET...3 1.2. KORT BESKRIVELSE AV UTSTYRET...3 2. INTRODUCTION (ENGLISH)... 3 2.1. THE PURPOSE OF THIS DOCUMENT...3 2.2. BRIEF DESCRIPTION OF THE EQUIPMENT...3 2.3. DEFINITIONS AND ABBREVIATIONS...4 3. REQUIREMENTS... 4 3.1. GENERAL...4 3.2. PROBE STATION...4 3.3. MICROSCOPE...5 3.4. LASER (OPTIONAL)...5 2
1. Innledning (Norsk) Hoveddelen av denne kravspesifikasjonen er skrevet på engelsk da det ikke finnes noen kjente norske leverandører av slike produkter. Seksjon for elektroniske sport ved Kripos har besluttet å gå til innkjøp av utstyr for probing og kutting av integrerte kretser. 1.1. Hensikten med dette dokumentet Kravspesifikasjonen beskriver de funksjonelle og tekniske kravene til en komplett probestasjon med laserkutter. Leverandører som ønsker å legge inn anbud må forholde seg til dette dokumentet. 1.2. Kort beskrivelse av utstyret En probestasjon for integrerte kretser er en svært stabil, og spesialisert arbeidsbenk. Den integrerte kretsen som skal undersøkes festes til arbeidsbordet ved hjelp av vakuum, mekaniske klammer eller magnetisme. Arbeidsbordet kan posisjonere elektronikken som skal undersøkes med stor presisjon. Posisjoneringen gjøres ved hjelp av håndsveiver eller elektromotorer. For å kunne oppnå ønsket presisjon er hele probestasjonen plassert på et trykkluftbasert vibrasjonsdempende bord. Ved hjelp av probeholdere som festes til probestasjonen kan man opprette elektrisk forbindelse til punkter inne på den integrerte kretsen. Probeholderene kan plassere skarpe nåler på den integrerte kretsen med en presisjon i størrelsesorden 1µm. Probespissene kan ha en diameter ned mot 1µm. Probenålene posisjoneres visuelt ved hjelp av et kraftig mikroskop som også festes til probestasjonen. Til mikroskopet kan det også festes en laser som brukes til å kutte i den integrerte kretsen. Laseren kan operere på forskjellige bølgelengder avhengig av hva slags materiale man ønsker å kutte i. 2. Introduction (English) The Digital Forensic Section at the Norwegian National Criminal Investigation Service has decided to acquire equipment for probing and cutting integrated circuits. 2.1. The purpose of this document The requirement specification describes the functional and technical requirements for a complete probe station including a laser- cutting device. Suppliers who want to give a quote on this kind of equipment must pay close attention to the specification. 2.2. Brief description of the equipment A probe station for integrated circuits is a very stable, and highly specialized workbench. The electronic device is clamped to the table either by vacuum, mechanical clamps or magnetism. The work holder is capable of positioning the device to be investigated with great precision by means of hand operated cranks or electrical servos. To maintain the precision, the entire probe station is placed on a pneumatic vibration- isolating bench. 3
To establish electrical connection to internal nodes on the integrated circuit, several probe holders are attached to the probe station table. The probe holders are able to position a very sharp needle at the integrated circuit with precision in the range of 1µm. The needle may have a tip as small as 1µm. To visually place the probe needles, a powerful microscope is also attached to the table and optionally a laser can be attached to the microscope. The laser is capable of emitting on a range of wavelengths, which is selected depending on the type of material to cut. 2.3. Definitions and abbreviations Integrated circuit: Electronic component made of semiconductor that incorporates complex functionality on a very small area. Typical devices are microcontrollers and memory chips. PCB: Printed Circuit Board. A board, usually made of fibre glass, with thin copper layers where electronic components are mounted into complete electronic systems. Wafer: Thin circular disk of silicon that is used in the manufacturing of integrated circuits. A wafer may contain thousands of integrated circuits, which is cut in pieces and packed individually. 3. Requirements The requirements are divided into several sub categories. Some of the parts are mandator, while others are considered optional. The optional parts are considered against the cost of the system. Also, this specification does not list all sub components of a complete system, but focuses on the desired features of the system, and the main components. It is important that any quote takes this into consideration and lists the cost of each sub component separately. The quote should include all necessary parts for an operational system, and it must be made clear which components that are mandatory and which are optional. 3.1. General Given a confirmed order by mid October 2010, the system must be delivered by December 15 th, 2010. 3.2. Probe station Maximum capacity must be at least 150mm in diameter. Must be able to clamp down a single integrated circuit that is not mounted on a pcb. Positional resolution on the X- Y axis must be better than 0.5µm. Positional repeatability on the X- Y axis must be 1µm or better. 4
Manual adjustment of position. Vacuum clamping of integrated circuit. Mechanical clamping of integrated circuit. Capable of placing at least 4 simultaneous probes, preferably 6. Probe precision 1µm or better. Must be mounted on a vibration isolating bench. 3.3. Microscope Capable of up to 20x to 400x magnification in discrete steps or using zoom. Capable of transmitting the wavelengths emitted by the laser specified below. Removable beam splitter for laser operation. Suitable lighting solutions. Option for adding polarization filters. Option for capturing digital images through the microscope. Option for real time video on monitor. 3.4. Laser (optional) Emit wavelengths suitable for cutting copper, aluminium and silicon oxide layers (Green and UV3). Other wavelengths are optional. Adjustable shutter with opening down to 1µm x 1µm. Guide light for visual indication of the cut area. Compatible with suggested microscope. 5